Intel and Submer, in collaboration, have formulated an innovative development in single-phase immersion cooling technology, delivering optimal heat dissipation to CPUs rated at up to 1000W.
Intel & Submer Creates Innovation “FCHS” Package, Immersion Tech For Up To 1000W CPU Cooling Capabilities
For those unaware of Submer, they are a Spanish firm that specializes in enabling data centers globally, along with managing cooling solutions of HPC, hyperscale, data centers, Edge, AI, DL, and blockchain applications. With the rapid progression of technology in the AI industry, the power drawn from individual components has increased at a significant rate, giving rise to the need to eradicate issues related to the thermals of such components. Intel and Submer have achieved a huge advancement, what they call a Forced Convection Heat Sink (FCHS) package, which aims at taking thermal dissipation to the next level.
Many have challenged the technological runway of single-phase immersion cooling. The Forced Convection Heat Sink is the undeniable proof that immersion is here to compete head-on with other liquid cooling technologies, including Direct Liquid Cooled water-based cold plates.
–Daniel Pope, Co-Founder and CEO of Submer
While neither of the companies has disclosed the official working mechanism of the technology, we are aware of the fact that FCHS harnesses the power of “liquid cooling” scrambled into two cold plates, which not only enhances the thermal transfer but also aids in the cooling process. It is revealed that by utilizing the technology, Intel and Submer were able to run an undefined Xeon processor (probably Sapphire Rapids) at 800W+ power, getting them closer to the milestone of running a CPU at 1000W.
The FCHS package combines the efficiency of forced convection with passive cooling, enabling the cooling of high TDP CPUs and GPUs in single-phase immersion systems. Its fail-proof design also enables natural convection in the event of propeller failure.
The FCHS is not only highly efficient but also cost-effective. Its components are cheap to manufacture and even present the possibility of being 3D printed.
Designed for easy retrofitting into any existing server and immersion tank setups, the FCHS empowers datacenters to swiftly handle high-density compute workloads.
Competitive Thermal Performance
The FCHS delivers thermal resistances that rival those of Direct Liquid Cooling (DLC), making it a formidable competitor in the liquid cooling landscape. If desired, the package returns thermal management to the server by enabling BIOS PWM control.
This technological breakthrough paves the way for even higher TDPs and future collaborations, solidifying single-phase immersion as a leading cooling solution.
Apart from the upgraded cooling, the FCHS system is said to be cost-effective, with its simple structural design that can be 3D printed as well. Moreover, Submer has made the mechanism easier to integrate into any system, whether in a server or even individual immersion tank setups. The involved companies see it as a “monumental breakthrough” for the server industry since a high-end cooling mechanism will ultimately help in achieving high TDP targets, exceeding the 1000W barrier.
The FCHS package will officially be introduced at the OCP Global Summit which will be held from October 17th to October 19th. We will be following the event, and in case something is interesting, we will indeed reveal it to you.
News Source: Submer